Semiconductor Packaging: Materials Interaction and Reliability (Record no. 49825)

MARC details
000 -LEADER
fixed length control field 01538 a2200181 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250324121907.0
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781138075405
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.38152 CHE
100 ## - MAIN ENTRY--PERSONAL NAME
Personal name Chen, Andrea
245 ## - TITLE STATEMENT
Title Semiconductor Packaging: Materials Interaction and Reliability
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Name of publisher, distributor, etc CRC Press
Date of publication, distribution, etc 2017
Place of publication, distribution, etc Boca Raton
300 ## - PHYSICAL DESCRIPTION
Extent 198
520 ## - SUMMARY, ETC.
Summary, etc In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Microelectronic Packaging
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Semiconductor Packaging
700 ## - ADDED ENTRY--PERSONAL NAME
Personal name Hsiao-Yu Lo, Randy
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Book
Source of classification or shelving scheme Dewey Decimal Classification

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