Advanced Semiconductor Device Physics and Modeling
Material type:
TextPublication details: Boston:: Artech House,, 1994Description: 498pISBN: - 0890066965
- 621.38152 LIO 20
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
Reference Book
|
Alliance College of Engineering and Design | Electronics and Communication Engineering | 621.38152 LIO (Browse shelf(Opens below)) | Not for loan | E14791 | |||
|
Reference Book
|
Alliance College of Engineering and Design | Electronics and Communication Engineering | 621.38152 LIO (Browse shelf(Opens below)) | Not for loan | E01566 |
Total holds: 0
Browsing Alliance College of Engineering and Design shelves, Collection: Electronics and Communication Engineering Close shelf browser (Hides shelf browser)
| 621.38152 FOR Semiconductor Supply Chain: Enterprise-Wide Planning Challenges | 621.38152 LAU Semiconductor Advanced Packaging | 621.38152 LAU Semiconductor Advanced Packaging | 621.38152 LIO Advanced Semiconductor Device Physics and Modeling | 621.38152 LIO Advanced Semiconductor Device Physics and Modeling | 621.38152 MAR Semiconductor Modeling Techniques | 621.38152 NIX Thin Films: Stresses and Mechanical Properties III Symposium Held December 2-5, 1991, Boston, Massachusetts, USA |
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