TY  - GEN
AU  - Tummala, Rao R
TI  - Fundamentals of Device and Systems Packaging: Technologies and Applications
SN  - 9789390385515
U1  - 621.381 TUM 
PY  - 2019///
CY  - Chennai
PB  - McGraw Hill Education (India) Private Limited
KW  - Microelectronic packaging
N2  - This thoroughly revised book offers the latest, comprehensive fundamentals in device
and systems packaging technologies and applications. Readers will get in-depth
explanations of the 15 core packaging technologies that make up any electronic
system, including electrical design for power, signal, and EMI; thermal design by
conduction, convection, and radiation heat transfer; thermo-mechanical failures and
reliability; advanced packaging materials at micro and nanoscales; ceramic, organic,
glass, and silicon substrates. This resource also discusses passive components such as
capacitors, inductors, and resistors and their proximity integration with actives;
chip-to-package interconnections and assembly; wafer and panel embedding
technologies; 3D packaging with and without TS; RF and millimeter-wave packaging;
role of optoelectronics; mems and sensor packaging ;encapsulation, molding and
sealing; and printed wiring board and its assembly to form end-product systems.
Fundamentals of Device and Systems Packaging: Technologies and Applications,
Second Edition introduces the concept of Moore’s Law for packaging, as Moore’s Law
for ICs is coming to an end due to physical, material, electrical, and financial
limitations. Moore’s Law for Packaging (MLP) can be viewed as interconnecting and
integrating many smaller chips with high aggregate transistor density, at higher
performance and lower cost than Moore’s Law for ICs. This book lays the groundwork
for Moore’s Law for Packaging by showing how I/Os have evolved from one package
family node to the next, starting with <16 I/Os in the 1960s with leadframe-plastic
packages to the current silicon interposers with about 200,000 I/Os
ER  -