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Semiconductor Advanced Packaging

By: Publication details: Singapore: Springer , 2021Description: 498ISBN:
  • 9789811613784
Subject(s): DDC classification:
  • 621.38152 LAU
Summary: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
List(s) this item appears in: New Arrivals for the Month of February 2024
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Holdings
Item type Current library Collection Call number Status Date due Barcode Item holds
Reference Book Reference Book Alliance College of Engineering and Design Electronics and Communication Engineering 621.38152 LAU (Browse shelf(Opens below)) Not for loan E14869
Reference Book Reference Book Alliance College of Engineering and Design Electronics and Communication Engineering 621.38152 LAU (Browse shelf(Opens below)) Not for loan E14409
Total holds: 0

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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